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Multilevel stencils also known as step stencils are the solution for the new electronic assemblies which include mixed technology applications like fine pitch technology with through-hole and SMT technologies. This mix requires different amounts of solder paste for different parts.
• Provide optimum solder paste volume control
• Eliminate co-planarity problems
• Foils are permanently mounted into aluminum frames
Overview
Doyan has the technical ability to manufacture step stencils (or multilevel stencils) by utilizing laser cutting and micro-milling technologies. Laser cutting ensures precise aperture and CNC milling ensures smooth and consistent thickness transitions. By using various foil thicknesses on the same stencil, this can control solder paste deposit in fine pitch areas while printing sufficient solder on large or through-hole pitch areas.
Advantage
• Step stencils provide optimum solder paste volume control
• Step stencil can eliminate two print processes in some cases
• Step stencil can replace multiple stencils
• Stencils with relief pocket-step in the area of protrusions will solve the problem of gasketing, paste smearing and risk of electrical short
• Multiple steps can be achieved including step on squeegee side and relief on board side on the same stencil
Specs
| Technology | 100% laser cut |
| Material (foil) | FG stainless steel |
| Stencil Thickness | 0.002" to 0.016" |
| Minimum Cut Width | 0.002" |
| Maximum Size | 29"x29" inches |
| Aperture Tolerance | within 0.00025" |
| Allow for Fiducial Data | Yes |
| Allow for Panelized Data | Yes |
Available Frame
| Frame Size | Max. Foil Size | Max. Image Size |
| 8"x10" | 6"x8" | 4"x6" |
| 10"x10" | 8"x8" | 6"x6" |
| 12"x12" | 10"x10" | 8"x8" |
| 12"x17" | 10"x15" | 8"x13" |
| 15"x15" | 13"x13" | 11"x11" |
| 23"x23" | 19"x19" | 17"x17" |
| 29"x29" | 25"x22" | 23"x20" |
