The thirteen standards commonly used by SMT stencil

The thirteen standards commonly used by SMT stencil

 1) IPC-ESD-2020: A joint standard for electrostatic discharge control program development. Covers the design, build, implementation, and maintenance necessary for electrostatic discharge control procedures. Provides guidance for handling and protection during electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.
　　2) IPC-SA-61A: Manual for post-weld semi-hydraulic cleaning. Includes all aspects of semi-hydraulic cleaning, including chemical, production residues, equipment, processes, process control, and environmental and safety considerations.

　　3) IPC-AC-62A: Manual for Post-Weld Aqueous Cleaning. Describes manufacturing residues, types, and properties of aqueous cleaning agents, the process of aqueous cleaning, equipment and processes, quality control, environmental control, and employee safety, and the determination of cleanliness and the cost of the determination. SMT stencil Stencil

　　4) IPC-DRM -4 0E: Desktop reference manual for through-hole solder joint evaluation. A detailed description of components, hole walls, and solder surface coverage as required by the standard, in addition to computer-generated 3D graphics. Covers solder fill, contact angle, dip, vertical fill, pad coverage, and numerous solder joint defects.

　　5) IPC-TA-722: Soldering Technology Evaluation Manual. Includes 45 articles on all aspects of soldering technology, covering general soldering, solder materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering, and infrared soldering. Laser Stencil

　　6) IPC-7525: Stencil Design Guide. Provides guidelines for the design and fabrication of solder paste and surface mount adhesive coated stencils Also discusses stencil design for applying surface mount technology and introduces stencils with through-hole or flip-chip components? gunnery techniques, including overprinted, double-printed, and staged stencil designs.

　　7) IPC/EIA J-STD-004: Specification Requirements for Flux I including Appendix I. Contains technical specifications and classification of rosin, resin, etc., organic and inorganic fluxes classified according to the content of halides in the flux and the degree of activation; also includes the use of fluxes, substances containing fluxes and low residual fluxes used in the no-clean process.

　　8) IPC/EIA J-STD -005: Solder paste specification requirements an including Appendix I. Lists the characteristics of the solder paste and technical specifications requirements, also includes test methods and standards for metal content, as well as stickiness, collapse, solder balls, stickiness, and solder paste staining properties. PCB stencil

　　9) IPC/EIA J-STD -0 06A: Specification requirements for electronic grade solder alloys, fluxes, and non-flux solid solders. For electronic grade solder alloys, for rod, tape, powder flux, and non-flux solder, for electronic solder applications, to provide terminology nomenclature, specification requirements, and test methods for special electronic grade solder.

　　10) IPC-Ca-821: General requirements for thermally conductive adhesives. Includes requirements and test methods for thermally conductive dielectrics for bonding components to suitable locations.

　　11) IPC-3406: Guide to the application of adhesives to conductive surfaces. Provides guidance on the selection of conductive binders as solder alternatives in electronics manufacturing.

　　12) IPC-AJ-820: Assembly and Soldering Manual. Contains descriptions of inspection techniques for assembly and soldering, including terms and definitions; types of printed circuit boards, components, and pins, materials for solder joints, component mounting, specification references and outlines for design; soldering techniques and packaging; cleaning and laminating; quality assurance and testing.

　　13) IPC-7530: Temperature profile guide for batch soldering processes (reflow and wave soldering). Various test means techniques and methods are used in temperature profile acquisition to provide guidance for building better graphics.